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PCB-Specifications
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PCB-Name
*
Your PN
Delivery-format:
Single-PCB
Panel
Multi-Panel
Quantity
(Single-PCB)
(Multi-Panel)
*
Panel
pcs.
Material
FR4 (min. TG135)
FR4 TG150
FR4 TG170
FR4 TG180
Panel-width
PCB-width
mm
Panel-length
PCB-length
mm
Panel-width
mm
Panel-length
mm
Quantity of different PCB-designs in Panel
2
3
4
5
more
Panel-layout:
Quantity of pieces in panel
pcs.
Panel-frame
no
yes
Mechanical panel-processing
none
v-cut
routing and v-cut
routing
Fastener
Yes
No
Perforation
Without perforation
With perforation
Position
Position and lenght of fastener accurately defined in files or panel-drawing
Free choice of position and lenght of fastener
Position and details of fastener accurately defined in files or panel-drawing
Free choice of position and layout of fastener
Files provided in Panel-form already
Generate panel-files according to provided panel-drawing
Provide solder-paste-files in panel-format
Bad-boards in panel allowed (x-out)
Yes
No
Number of layers
0
1
2
4
6
8
10
12
more
Stack-up
free choice
special stack-up
Additional Prepregs
0
1
2
3
4
5
6
8
Final-PCB-thickness
mm (tol. ±10%)
Contour
rectangle
special contour
Finish-Surface
HAL-PB-free
immersion nickel/gold - ENiG (max. area 20%)
immersion silver
immersion tin
Bondgold (ENEPIG)
OSP
none (bare copper or bare FR4)
Solder-mask openings
mm²
Base copper-thickness outer-layers
Final copper-thickness outer-layers
18
35
70
105
140
175
210
µm
Base copper-thickness inner-layers
12
18
35
70
105
140
175
210
µm
Track width/gap - outer layers
50
75
90
100
125
150
200
250
300
400
500
µm
Track width/gap - inner layers
50
75
90
100
125
150
200
250
300
400
500
µm
Solder-mask
No
1-side
2-side
Colour
green
black
white
red
blue
yellow
Legend-print
No
1-side
2-side
Colour
white
black
yellow
Minimum hole-diameter
> 0,25
0,2
mm
Number of holes/multi panel
Number of holes/PCB
pcs.
Via-protection (up to 0,5mm)
Cover/clear vias as in data with solder resist
Clear all vias, even if covered in data
Cover all vias, even if cleared in data
Via-in-Pad technology, Via filled with resin according to IPC4761 Type V-VII
IPC classification
IPC Class 2
IPC Class 3
Markings
Only date code and RoHS compliant
Date code, RoHS compliant and UL marking
Markings in
freely selectable
Solder-Resist top
Solder resist bottom
Silkscreen top
Silkscreen bottom
Copper top
Copper bottom
Position of markings
freely selectable
defined in the PCB data
E-Test
Electrical-Test of all PCB's (without extra charge)
No (PCB without electrical function)
Additional options
Peel-able Solder mask (Bluemask)
No
Peel-able mask on Top
Peel-able mask on Bottom
Peel-able mask both side
Kapton-Tape on Top
Kapton-Tape on Bottom
Kapton-Tape both side
Impedance-test
Yes
No
Impedance calculated, without test
Plated-edges / Half-holes (plated)
Pressfit hole-tolerance +/-0,5mm
Blind-vias
Buried-vias
Hard-gold connector
Test report (CoC-report)
impedance test report
* These fields must be filled in
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Total costs
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Lead time
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Netherlands
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Slovakia
Slovenia
Switzerland
United Kingdom
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Contact
sas-electronics
contact@sas-electronics.de
+49 (0) 84 46 / 92 99 6 - 0